Polyimides (PI) & Polybenzoxazoles (PBO) | 食品添加物合法業者資訊網
2020年9月27日—ThepatternorremainingpolymerlayeristhermallycuredtoproducethePIfilmpattern.Ontheotherhand,PBO'sgenerallyarepositive- ...
Fan-Out Wafer Level Packaging Process Flow ( Source - Yole
Development)
Polyimide (PI) and Polybenzoxazole (PBO) products are typically used as a stress relief and protective insulating layer before packaging or redistribution layer (RDL).
PI and PBO plays a critical role in advanced microelectronic packaging as an insulating material and can be processed as a standard photolithography process. Conventionally, photoresist was used on top of the PI/PBO polymer to develop the etching pattern, but to simplify the manufacturing process & cost, photosensitive PI/PBO polymer were developed later on. These polymers possess several outstanding features such as high thermal stability, chemical resistance, low flammability & low dielectric constant for the use in advanced packaging technology. Relatively, PBO’s has lower dielectric consta...